High-speed Micro-machining Equipment

SFP1313 laser high-speed micro-machining equipment is a rotating polygon mirror based two-dimensional scanning and micro-structuring process.It greatly increase the speed of surface processing. It has the absolute advantage of high efficiency and high speed for micro-hole processing.

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Technical Parameters of High-speed Micro-machining Equipment

Model	SFP1313
Machine Size(mm)	2090×1820×2000
Workbench Size(mm)	400×400
Laser Power(w)	500
Laser Wavelength(nm)	1064
Laser Pulse Width(ns)	30/60/120/240
Laser Frequency(kHz)	2000/1000/500/500
Diameter of Focused Spot(μm)	≤40
Effective Focal Length(mm)	420
Scanning Range(mm)	300×300
Scanning Speed(m/s)	≤600m/s
Scanning Line Frequency(Hz)	1600
Scanning Repeat Positioning Accuracy(μm)	±3μm
Processing Methods	Linear mode, dot matrix mode, bmp mode
Positioning Method	Polygon mirror scanner is matched with mechanical shaft

Processing Thickness of High Speed Micro Hole Drilling Machine

Laser Power	Laser pulse repetition rate	Scanning speed	Material	Thickness
500W	500kHz	50m/s-500m/s	Stainless steel	10μm-300μm
500W	500kHz	50m/s-500m/s	Titanium alloy	10μm-300μm
500W	500kHz	50m/s-500m/s	Zirconium alloy	10μm-300μm
500W	500kHz	50m/s-500m/s	Silicon chip	0.1mm
500W	500kHz	50m/s-500m/s	Aluminum alloy	0.15mm

Processing Methods of Micro-machining Equipment

Laser lattice scanning	Laser linear scanning	High-speed BMP bitmap processing
Laser drilling	Laser linear cutting	----
High density micro-hole array processing	Laser beam grooving	----

Advantages of High-speed Micro-machining Equipment

Scanning speed can reach an unprecedented 600m/s.

High repeat positioning accuracy ±5μm: the unique design of high-speed polygon mirror reduces scanning distortion and ensures repeat positioning accuracy.There is no deviation in hole position during micro-machining.

The FPGA control system provides a proprietary synchronization function to trigger the laser and scan position information, which can ensure the spot repeatability.

Workbench and beam are made of marble to make the whole machine durable and maintain excellent accuracy. Integrated control of external machining axis to realize larger scanning area.

Application of Micro Hole Machining

Laser high-speed micro-machining equipment is widely applied from drilling, perforate, microstructuring, micromachining in structuring wafers,

touchscreen surfaces or solar cells, to micro-drilling and processing of electronic components, glass and plastics, as well as sensor manufacturing., cutting-edge interdisciplinary research, etc.

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High-speed Micro-machining Equipment

Technical Parameters of High-speed Micro-machining Equipment

Application of Micro Hole Machining

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